IC Packaging

Dedicated to Being Your Preferred Solution Provider Pushing the limits worldwide

Our Products

SPIL provides comprehensive packaging, offering lead frame base and substrate base packages, with either wire bond or flip chip interconnections. These packages satisfy most applications for customers serving the PC, hand-held product, consumer product and wire communication markets.

Besides the conventional SOP and QFP packages, SPIL has been devoted to the development of wafer thinning, fine-pitch wire bonding, stacked-die bonding, wafer bumping and flip-chip assembly technologies in order to realize advanced packages like: QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP and FCBGA.

In order to meet our customer's future packaging requirements, we are continuously developing the next generation assembly technologies. Currently studies include: Through Silicon Vias, Integrated Passive Devices and 3D-SiP/3D-SIC packaging solutions.

Laminate Substrate

Wirebond

PBGA EDHS-PBGA TFBGA / VFBGA LGA

FlipChip

FCBGA FCCSP

Leadframe

Quad

QFP LQFP TQFP Thermally Enhanced QFP E-pad LQFP E-pad TQFP QFN

Dual

TSOP I / COL TSOP I TSOP II / LOC-TSOP II

Wafer Level (WLCSP)

Because of rapid movement toward semiconductor package miniaturization, a number of solutions have evolved as well that retain an outline that is the same or very near the same as the dieelement - WLCSP is ...

Stacked Die

The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. Siliconware Stacked die packages are...

Multi-Package

Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible. Multiple chips are integrated individually after undergoing functional...